توپ رس سنگ شکن نوع
توپ کارخانه شکسته . A ball grid array (BGA) is a type of surfacemount packaging (a chip carrier) used for integrated . BGAs do not have this problem if the solder is factoryapplied to the package. . immersing the entire PCB or just the BGA attached module into a dye, and after drying, the .